Plating

Leadframe Plating 

Offers different solutions for leadframe plating, addressing the needs for stand-alone or integrated systems.

Advanced Cut-strip Plating System

Advanced Cut-strip Plating System (ACP): SLE solution for accurate silverspot plating where mechanical masking becomes impossible! – New model available for wider and longer leadframes

Reel-to-Reel

solution for high speed spot plating with exceptional flexibility.

Leadframe solder plating

The system is fully customized to your specific needs and is a green solution, with low power consumption and minimal chemical usage.

The SLE Electro DeFlash and Electro Plating Line are designed for the future and are capable of handling any kind of leadframe product. Any leadframe size up to 110 x 315 mm can easily be handled on the SLE EDF/EPL.

Automatic Solder Dipping

A device that has a solder pot inside the device and immerses the IC in the melted solder for soldering. It has excellent production efficiency and is suitable for mass production.

SHENG LEE ENGINEERING

SLE is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. SLE develops leading edge assembly processes and equipment for leadframe, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. We are located in Singapore.