Leadframe Plating 

Offers different solutions for leadframe plating, addressing the needs for stand-alone or integrated systems.

Advanced Cut-strip Plating System

Advanced Cut-strip Plating System (ACP): SLE solution for accurate silverspot plating where mechanical masking becomes impossible! – New model available for wider and longer leadframes

Reel-to-Reel

solution for high speed spot plating with exceptional flexibility.

Leadframe solder plating

The system is fully customized to your specific needs and is a green solution, with low power consumption and minimal chemical usage.

The SLE Electro DeFlash and Electro Plating Line are designed for the future and are capable of handling any kind of leadframe product. Any leadframe size up to 110 x 315 mm can easily be handled on the SLE EDF/EPL.

Automatic Solder Dipping

A device that has a solder pot inside the device and immerses the IC in the melted solder for soldering. It has excellent production efficiency and is suitable for mass production.